Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
US6814893B2 · kind B2 · utility
1Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Jul 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2984
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.