Control signal transmitting method with package power pin and related integrated circuit package structure
US6815230B2 · kind B2 · utility
0Cited by
20References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2001 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Mar 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and a device are disclosed for transmitting a control signal to an option pad of an integrated circuit chip at its package level. The method includes the steps of: electrically isolating one of a plurality of commonly connected power transmitting pins of the integrated circuit package; connecting the electrically isolated power transmitting pin to the option pad to thereby transmit a control signal from outside through the electrically isolated power transmitting pin to the option pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.