Electroless copper deposition apparatus
US6815349B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Mar 19, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/89
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for holding work pieces during electroless plating has certain improved features designed for use at relatively high temperatures (e.g., at least about 50 degrees C.). Cup and cone components of a “clamshell” apparatus that engage a work piece are made from dimensionally stable materials with relatively low coefficients of thermal expansion. Further, O-rings are removed from positions that come in contact with the work piece. This avoids the difficulty caused by O-rings sticking to work piece surfaces during high temperature processing. In place of the O-ring, a cantilever member is provided on the portion of the cone that contacts the work piece. Still further, the apparatus makes use of a heat transfer system for controlling the temperature of the work piece backside during plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.