Semiconductor electronic device and method of manufacturing thereof
US6815789B2 · kind B2 · utility
7Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Dec 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20755
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor electronic device includes a die of semiconductor material and a support. The die of semiconductor material includes an integrated electronic circuit and a plurality of contact pads associated with the electronic circuit and connected electrically to the support by wire leads. Each contact pad may include a lower layer of aluminum, copper, or alloys thereof, and an upper layer including at least one film of a metal and/or metallic alloy including nickel, palladium, or alloys thereof, and being deposited by an electroless chemical process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.