Method and apparatus for stress testing integrated circuits using an adjustable AC hot carrier injection source
US6815971B2 · kind B2 · utility
60Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Dec 29, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2858
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is provided for stress testing integrated circuits to determine their susceptibility to hot carrier charge injection damage. The system includes a hot carrier injection source formed on a semiconductor wafer carrying the ICs under test. The carrier source comprises an adjustable, voltage controlled oscillator having a variable frequency AC output test signal, and a modulator circuit for varying the duty cycle of the test signal applied to the ICs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.