Exposure control apparatus in a lithography system and method thereof
US6816230B2 · kind B2 · utility
1Cited by
4References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 11, 2001 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Dec 27, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70558
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There is disclosed an exposure control method in a lithography system having a resist coating and developing apparatus, a wafer transferring mechanism and an exposure control apparatus. The exposure control method in the lithography system includes the steps of transmitting data of temperature for heat-treating a resist film in the resist coating and developing apparatus to the exposure control apparatus; determining and controlling exposure time based on the temperature data; and exposing the resist film on a wafer which is moved or transferred by the wafer transferring mechanism during the determined exposure time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.