Method for assembling a circuit board apparatus with pin connectors
US6817092B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2001 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Jul 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a circuit board from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board and solder applied to the pins at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections between the pins and conductive traces on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.