Photoresist dispense arrangement by compensation for substrate reflectivity
US6818064B2 · kind B2 · utility
8Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2001 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Nov 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02118
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the manufacture of a semiconductor device, an arrangement for forming a layer on a semiconductor substrate compensates for variations in wafer substrate reflectivity. The arrangement includes providing substrate illumination and then adjusting the illumination on the substrate. The arrangement also includes controlling the dispensation of material over the substrate as a function of the adjusted illumination. By compensating for variations in wafer substrate reflectivity, manufacturing processes can realize more consistent photoresist coatings on wafer substrates from one wafer lot to another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.