Methods of fabricating microelectronic features by forming intermixed layers of water-soluble resins and resist materials
US6818384B2 · kind B2 · utility
3Cited by
4References
32Claims
0Family size
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Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Nov 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/143
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist pattern can be formed on a microelectronic substrate, the resist pattern comprising a resist material. A coating layer, including a water-soluble resin, is formed on the resist pattern, wherein the water-soluble resin and the resist material are miscible with one another and intermix to provide an intermixed layer comprising the resist material and the water-soluble resin between the resist pattern and a non-intermixed coating layer. The intermixed layer can be hardened and the non-intermixed coating layer can be removed from the hardened intermixed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.