Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls
US6818541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2003 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Apr 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.