Pan-Nan Chen
3Patents
1h-index
14Co-inventors
45Inventor score
Filing activity: Feb 26, 2003 → Nov 4, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6870261B2 | Discrete circuit component having an up-right circuit die with lateral electrical connections | Electricity | 4 | Expired |
| US6818541B2 | Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls | Electricity | 1 | Expired |
| US12359392B1 | Thermosyphon foundation, method of calculating cold conductivity enhancement coefficient and method of cold conductivity enhancement thereof | Fixed Constructions | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.