Process and apparatus for mounting semiconductor components to substrates and parts therefor
US6818543B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | Jul 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a process and apparatus for mounting semiconductor components to substrates. More particularly, the apparatus includes a placing mechanism positioned on a support frame for placing the semiconductor components to the substrates. A reflow oven/furnace is integrated into the apparatus, thereby eliminating the need to transport the semiconductor components and substrates to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array adapted for efficient application of suction to substrates carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders provided on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.