Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs

US6821032B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Rickie C. Lake · Eagle, US
• Xiaowei Yao · San Jose, US
• Charles Askew · Mountain View, US
• Marc Epitaux · Sunnyvale, US
• Marc Finot · Palo Alto, US
• Jeffrey A. Bennett · San Antonio, US
• Robert Kohler · Mountain View, US
• Jean-Marc Verdiell · Palo Alto, US

Key dates

• Filing date: May 28, 2002
• Grant date: Nov 23, 2004
• Expiry date: Nov 20, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/3803
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.