Xiaowei Yao
5Patents
1h-index
10Co-inventors
44Inventor score
Filing activity: May 28, 2002 → Oct 22, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6821032B2 | Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs | Physics | 16 | Expired |
| US7350987B2 | Optical package fiber pass-through to reduce curvature of optical fiber during threading | Physics | 1 | Expired |
| US7019394B2 | Circuit package and method of plating the same | Electricity | 0 | Expired |
| US9892541B2 | Methods for a programmable primitive setup in a 3D graphics pipeline and apparatuses using the same | Physics | 0 | Active |
| US7405155B2 | Circuit package and method of plating the same | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.