Method and apparatus for mounting semiconductor chips onto a flexible substrate
US6821375B2 · kind B2 · utility
5Cited by
17References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 2, 2001 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Jul 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.