Method for improving adhesion to copper

US6821890B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Vincent J. McGahay · Poughkeepsie, US
• Thomas Ivers · Petersburgh, US
• Joyce C. Liu · Carmel, US
• Henry A. Nye, III · Brookfield, US

Key dates

• Filing date: May 7, 2001
• Grant date: Nov 23, 2004
• Expiry date: Aug 11, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Poorly adherent layers such as silicon nitride and silicon dioxide exhibit improved adhesion to copper member by providing an intervening germanium-containing layer. The germanium-containing layer is copper germanide, germanium oxide, germanium nitride or combinations thereof. The germanium-containing layer enhances the adhesion such that the poorly adherent layer is less susceptible to delamination from the copper member.