Leadframe for enhanced downbond registration during automatic wire bond process
US6822319B1 · kind B1 · utility
3Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2003 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Mar 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for enhancing visual detectability of a leadframe having a die attach pad and a plurality of contacts, during automated wirebonding in the production of an integrated circuit package. At least one of a ring, a line and an array of dots are plated on the die attach pad of the leadframe and around a periphery of the die attach pad. The leadframe is surface treated to cause a color change on a surface of the leadframe for improved visual detectability of the at least one of the ring, the line and the dots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.