Integrated circuit connecting pad
US6822329B2 · kind B2 · utility
23Cited by
6References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2002 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | May 14, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/92
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Each connecting pad includes a continuous top metal layer on the top metallization level and having on its top face an area for welding a connecting wire. Also, the pad has a reinforcing structure under the welding area and includes at least one discontinuous metal layer on the immediately next lower metallization level, metal vias connecting the discontinuous metal layer to the bottom surface of the top metal layer, and an isolating cover covering the discontinuous metal layer and its discontinuities as well as the inter-via spaces between the two metallic layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.