Assembly of opto-electronic module with improved heat sink
US6822875B2 · kind B2 · utility
16Cited by
12References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2002 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Oct 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.