Heat resistant resin composition, a heat resistant film or sheet thereof and a laminate comprising the film or the sheet as a susbstrate
US6824884B2 · kind B2 · utility
7Cited by
1References
5Claims
0Family size
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Key dates
| Filing date | Feb 5, 2003 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Feb 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat resistant resin composition comprising 70 to 30 wt % of a crystalline polyarylketone resin having a peak crystalline melting temperature of 260° C. or higher and 30 to 70 wt % of a noncrystalline polyetherimide resin, wherein said composition has at least 2 peaks of loss tangent (tan &dgr;) between 140° C. and 250° C., determined by dynamic mechanical measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.