Method and apparatus for separating member
US6825099B2 · kind B2 · utility
21Cited by
17References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2002 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | May 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention is to appropriately separate a bonded substrate stack regardless of some distortion in the bonded substrate stack or the like. This separating apparatus includes a position adjusting mechanism (140) for adjusting the position of a nozzle (120) which ejects a fluid. A bonded substrate stack (50) is separated while changing the level of the nozzle (120) stepwise by the position adjusting mechanism (140) in accordance with a program which is set in advance on the assumption that the bonded substrate stack (50) has a distortion within a predetermined range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.