Patent · US Expired

Method for removing structures

US6825116B2 · kind B2 · utility

0Cited by

15References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Gerhard Beitel · Kamakura, JP
Mattias Ahlstedt · Delft, NL
Walter Hartner · Munich, DE
Gunther Schindler · Hersbruck, DE
Marcus Kastner · Ottobrunn, DE
Volker Weinrich · Paris, FR

Key dates

Filing date	Apr 30, 2001
Grant date	Nov 30, 2004
Priority date	—
Expiry date	May 19, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH10B53/30
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for removing structures from a substrate is described. The method includes providing a substrate that has the structures that must be removed, applying a sacrifice layer, and removing the structures and the sacrifice layer in a polishing step. The method has the advantage that the sacrifice layer surrounds the structures that must be removed and stabilizes them, so that the structures can be eroded slowly and successively in the subsequent polishing step without breaking off. This prevents a smearing of the material of the structures such as occurs given direct polishing without a sacrifice layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.