Patent · US Expired

Method for treating semiconductor processing components and components formed thereby

US6825123B2 · kind B2 · utility

3Cited by

4References

28Claims

0Family size

Assignee

SAINT-GOBAIN CERAMICS & PLASTICS, INC. · US

Inventors

Andrew G. Haerle · Sutton, US
Richard F. Buckley · Shrewsbury, US
Richard R. Hengst · Oakham, US

Key dates

Filing date	Apr 15, 2003
Grant date	Nov 30, 2004
Priority date	—
Expiry date	Apr 15, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/26
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A method for treating a semiconductor processing component, including: exposing the component to a halogen gas at an elevated temperature, oxidizing the component to form an oxide layer, and removing the oxide layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.