Localized backside chip cooling with integrated smart valves
US6825557B2 · kind B2 · utility
52Cited by
7References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2002 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device is disclosed. The device comprises a die that has functional units on a first surface and a cooling system arranged adjacent a second surface opposite the first surface. The cooling system comprises a least one microchannel to contain a cooling liquid and to allow flow of the cooling liquid and at least one reservoir arranged adjacent to a region of the die. There is at least one valve between the reservoir and the microchannel to allow the cooling liquid to flow into the reservoir wherein flow of the cooling liquid depends upon a temperature of the die region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.