Inspection data analysis program, defect inspection apparatus, defect inspection system and method for semiconductor device
US6826735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2002 |
| Grant date | Nov 30, 2004 |
| Priority date | — |
| Expiry date | Sep 4, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Inspection data output from an inspection apparatus is read, the inspection data containing at least one information piece of coordinate value information and size information of a particle or a pattern defect of an inspected object, and drawing data of a product of the inspected object is read. Information is extracted which is representative of a relation between at least one information piece of coordinated value information and size information of the particle or pattern defect of the inspected object in the read inspection data and the read drawing data input at said drawing data input step. The extracted information is compared with determination criterion information registered beforehand and it is determined whether each particle or pattern defect of the inspected object in the inspection data is a detection error or not.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.