Flip chip-in-leadframe package and process
US6828220B2 · kind B2 · utility
34Cited by
21References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2001 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Mar 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for connecting a chip to a leadframe includes forming bumps on a die by a Au stud-bumping technique, and attaching the chip to the leadframe by thermo-compression of the bumps onto bonding fingers of the leadframe. Also a flip chip-in-leadframe package is made according to the method. The package provides improved electrical performance particularly for devices used in RF applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.