Patent assignee · US · COMPANY

ChipPAC, Inc.

75Patents
27Active
75Granted
40Portfolio score

Filing activity: Mar 9, 2001 → Jul 7, 2011 · 26 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US6933598B2 Semiconductor stacked multi-package module having inverted second package and electrically shielded first package Electricity 123 Expired
US6838761B2 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield Electricity 122 Expired
US6906416B2 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package Electricity 110 Expired
US7053477B2 Semiconductor multi-package module having inverted bump chip carrier second package Electricity 91 Expired
US6972481B2 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages Electricity 83 Expired
US7061088B2 Semiconductor stacked multi-package module having inverted second package Electricity 80 Expired
US7064426B2 Semiconductor multi-package module having wire bond interconnect between stacked packages Electricity 80 Expired
US7045887B2 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package Electricity 73 Expired
US7034387B2 Semiconductor multipackage module including processor and memory package assemblies Emerging Cross-Sectional Technologies 69 Expired
US6967126B2 Method for manufacturing plastic ball grid array with integral heatsink Electricity 67 Expired
US6815252B2 Method of forming flip chip interconnection structure Emerging Cross-Sectional Technologies 67 Expired
US7057269B2 Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package Electricity 65 Expired
US7049691B2 Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package Electricity 62 Expired
US7053476B2 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages Electricity 62 Expired
US7101731B2 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package Electricity 59 Expired
US6661083B2 Plastic semiconductor package Electricity 52 Expired
US7033859B2 Flip chip interconnection structure Emerging Cross-Sectional Technologies 46 Expired
US7253511B2 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package Electricity 40 Expired
US8970049B2 Multiple chip package module having inverted package stacked over die Electricity 40 Expired
US6940178B2 Self-coplanarity bumping shape for flip chip Electricity 37 Expired
US6780682B2 Process for precise encapsulation of flip chip interconnects Electricity 36 Expired
US6828220B2 Flip chip-in-leadframe package and process Electricity 34 Expired
US7671451B2 Semiconductor package having double layer leadframe Electricity 34 Active
US6549413B2 Tape ball grid array semiconductor package structure and assembly process Electricity 33 Expired
US7205647B2 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages Electricity 33 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.