Apparatus and methods for interconnecting components to via-in-pad interconnects
US6828512B2 · kind B2 · utility
5Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Dec 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate has at least one via-in-pad that includes a bond pad and a bore. In addition, the substrate has a plug coupled to the at least one via-in-pad, the plug has a first conductive material and adapted to couple with a solder ball having a second conductive material, the first conductive material having a higher reflow temperature than the second conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.