Kum Leong
4Patents
2h-index
5Co-inventors
33Inventor score
Filing activity: Oct 8, 2002 → May 21, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6828512B2 | Apparatus and methods for interconnecting components to via-in-pad interconnects | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7701069B2 | Solder interface locking using unidirectional growth of an intermetallic compound | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7692301B2 | Stitched micro-via to enhance adhesion and mechanical strength | Electricity | 0 | Active |
| US7229913B2 | Stitched micro-via to enhance adhesion and mechanical strength | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.