Power semiconductor module with ceramic substrate

US6828600B2 · kind B2 · utility

Assignee

• EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH · DE

Inventors

• Andreas Lenniger · Erwitte, DE
• Gottfried Ferber · Warstein, DE
• Alfred Kemper · Warstein, DE

Key dates

• Filing date: May 5, 2003
• Grant date: Dec 7, 2004
• Expiry date: May 5, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49153
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module is presented in which terminal elements are press-fitted into openings in a plastic housing. This measure improves the reliability of the internal bonds between the substrate and the terminal element since there is no longer a risk of the terminal elements loosening in the plastic housing.