Package for integrated circuit with internal matching
US6828658B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2002 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Aug 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package houses and connects to a die to form an integrated circuit with internal matching. The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead. Bond wires connect select locations along the at least one transmission line to ground through impedance matching circuit components located within the integrated circuit to provide an impedance matching network associated with at least one of the output leads. A plastic mold compound substantially encases the lead frame, while exposing the die paddle and the input/output leads. Incorporating the transmission line into the lead-frame avoids having to place the matching network outside of the integrated circuit package. That is, etching the lead frame to provide the transmission line, and placing components (e.g., capacitors, inductors, etc.) of the impedance transform matching circuit within the integrated circuit and connecting the components between select locations on the transmission line and ground is relatively inexpensive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.