Method of packaging a device with a lead frame, and an apparatus formed therefrom
US6828663B2 · kind B2 · utility
72Cited by
30References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2001 |
| Grant date | Dec 7, 2004 |
| Priority date | — |
| Expiry date | Mar 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of packaging a device and an apparatus formed by the method. According to one embodiment, the apparatus includes a base connected to the device, and a cover. The cover includes an injection molded plastic body and at least one electrically conductive lead. The body of the cover is connected to the base such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is electrically connected to the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.