Forming a through hole in a photoimageable dielectric structure
US6830875B2 · kind B2 · utility
2Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2002 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Feb 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming an electronic structure. Provides is a layer that includes a cylindrical volume of a photoimageable dielectric (PID) material, an annular volume of the PID material circumscribing the cylindrical volume, and a remaining volume of the PID material circumscribing the annular volume. The layer is photolithograhically exposed to radiation. The annular volume is fully cured by the radiation. The remaining volume is partially cured by the remaining volume by said radiation. The method prevents curing of the cylindrical volume, wherein the PID material in the cylindrical volume remains uncured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.