Resin-coated copper foil, and printed wiring board using resin-coated copper foil
US6831129B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Jun 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition:a.a high polymer having cross-linkable 5 to 30 parts by weightfunctional groups in the molecule, and across-linking agent thereforb.an epoxy resin that is liquid at 5 to 30 parts by weightroom temperaturec.a compound having the structure shown40 to 90 parts by weightin Formula 1where R is H or
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.