Tetsuro Sato
38Patents
7h-index
64Co-inventors
72Inventor score
Filing activity: Aug 8, 1980 → Sep 14, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4893988A | System for damping lead-lag motion of rotor blades of helicopter | Performing Operations; Transporting | 20 | Expired |
| US6541789B1 | High temperature superconductor Josephson junction element and manufacturing method for the same | Electricity | 15 | Expired |
| US6652962B1 | Resin-coated composite foil, production and use thereof | Emerging Cross-Sectional Technologies | 11 | Expired |
| US4384993A | Method of the production of immunoglobulin having high content of monomer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5218708A | Videotext communication network with a receiving terminal that automatically preforms operations to network responsive to predetermined schedule | Emerging Cross-Sectional Technologies | 10 | Expired |
| US5053665A | Retaining structure of brush spring of electric motor | Electricity | 9 | Expired |
| US6905757B2 | DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE | Emerging Cross-Sectional Technologies | 7 | Expired |
| US5800722A | Multilayer printed wiring board and process for manufacturing the same | Electricity | 6 | Expired |
| US7144472B2 | Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9216472B2 | Friction stir welding apparatus comprising slide plates | Performing Operations; Transporting | 4 | Active |
| US6716530B2 | RESIN COMPOUND FOR FABRICATING INTERLAYER DIELECTRIC OF PRINTED WIRING BOARD, RESIN SHEET AND RESIN APPLIED-COPPER FOIL FOR FORMING INSULATION LAYER USING THE RESIN COMPOUND, AND COPPER-CLAD LAMINATE USING THEM | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6739834B2 | Flexbeam | Performing Operations; Transporting | 4 | Expired |
| US11525073B2 | Multilayer circuit board manufacturing method | Electricity | 2 | Active |
| US8497026B2 | Porous metal foil and production method therefor | Emerging Cross-Sectional Technologies | 2 | Active |
| US6831129B2 | Resin-coated copper foil, and printed wiring board using resin-coated copper foil | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9185130B2 | Transmission apparatus, reception apparatus, communication system, transmission method, and reception method | Electricity | 1 | Active |
| US10457297B2 | Railcar | Emerging Cross-Sectional Technologies | 1 | Active |
| US8304091B2 | Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US8815387B2 | Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer | Emerging Cross-Sectional Technologies | 1 | Active |
| US11527415B2 | Multilayer circuit board manufacturing method | Electricity | 1 | Active |
| US7485361B2 | Multilayered printed wiring board and manufacturing method thereof | Emerging Cross-Sectional Technologies | 0 | Expired |
| US7163600B2 | Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer | Emerging Cross-Sectional Technologies | 0 | Expired |
| US11458400B2 | Information processing device, information processing method, and program for generating an added related to a predicted future behavior | Physics | 0 | Active |
| US11947119B2 | Display control device, display control method, and recording medium | Physics | 0 | Active |
| US11935865B2 | Semiconductor package manufacturing method, and adhesive sheet used therein | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.