Semiconductor device having an elastic resin with a low modulus of elasticity
US6831360B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2001 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Dec 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.