Low thermal resistance interface for attachment of thermal materials to a processor die
US6831836B2 · kind B2 · utility
13Cited by
18References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2003 |
| Grant date | Dec 14, 2004 |
| Priority date | — |
| Expiry date | Mar 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.