Hybrid integration of active and passive optical components on an Si-board

US6832013B1 · kind B1 · utility

Assignee

• Hymite A/S · DK

Inventors

• Jochen Kuhmann · Berlin, DE
• Mogens Poulsen · Copenhagen, DK

Key dates

• Filing date: Apr 23, 2002
• Grant date: Dec 14, 2004
• Expiry date: May 7, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12195
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The present invention relates to an assembly structure and a method for assembling active and passive photonic and/or optoelectronic devices on a silicon board. The invention relates in particular to an assembly structure and a method for aligning the photonic devices during the assembling procedure. According to the present invention, the assembly structure comprises one or more alignment features comprising tapered side surface parts in directions at least substantially parallel to an optical axis. By providing a tapering in a direction in a direction at least substantially parallel to the first optical axis, any inaccuracies primarily affects the non-critical positioning in the direction along the optical axis, whereas the critical positioning transverse to the optical axis merely depends on the symmetry of alignment features. The errors from the inherent inaccuracy of the position and shape of alignment features are thereby minimized. Also, the devices to be aligned are preferably arranged on top of the alignment features which forms part of the basic structure on the silicon board. All alignment features can thereby be defined in a single mask step together with the structures…