Patent assignee · DK · COMPANY

Hymite A/S

26Patents
10Active
26Granted
40Portfolio score

Filing activity: Apr 23, 2002 → Sep 24, 2009 · 10 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US6818464B2 Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes Emerging Cross-Sectional Technologies 105 Expired
US6856717B2 Package with a light emitting device Physics 43 Expired
US7528422B2 Package for a light emitting element with integrated electrostatic discharge protection Electricity 41 Active
US7531445B2 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane Electricity 31 Active
US6969204B2 Optical package with an integrated lens and optical assemblies incorporating the package Physics 28 Expired
US7419853B2 Method of fabrication for chip scale package for a micro component Electricity 28 Expired
US7057274B2 Semiconductor structures having through-holes sealed with feed-through metalization Emerging Cross-Sectional Technologies 26 Expired
US6786654B2 Encapsulated optical fiber end-coupled device Electricity 26 Expired
US7662710B2 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane Electricity 26 Active
US7467897B2 Light transmitting modules with optical power monitoring Electricity 21 Active
US7213978B2 Optical device receiving substrate and optical device holding carrier Electricity 11 Expired
US7165896B2 Light transmitting modules with optical power monitoring Electricity 11 Expired
US6832013B1 Hybrid integration of active and passive optical components on an Si-board Physics 11 Expired
US7253388B2 Assembly with self-alignment features to position a cover on a substrate that supports a micro component Performing Operations; Transporting 8 Expired
US7732829B2 Optoelectronic device submount Electricity 8 Active
US7109580B2 Hermetically sealed package for optical, electronic, opto-electronic and other devices Physics 8 Expired
US7543999B2 Optical module hermetically packaged in micro-machined structures Electricity 7 Expired
US7553695B2 Method of fabricating a package for a micro component Electricity 6 Expired
US7681306B2 Method of forming an assembly to house one or more micro components Emerging Cross-Sectional Technologies 5 Active
US7209235B2 Accurate positioning of components of a optical assembly Physics 3 Expired
US7388285B2 Hermetically sealed package for optical, electronic, opto-electronic and other devices Physics 3 Active
US7081412B2 Double-sided etching technique for semiconductor structure with through-holes Emerging Cross-Sectional Technologies 3 Expired
US7732234B2 Fabrication process for package with light emitting device on a sub-mount Electricity 2 Active
US7415180B2 Accurate positioning of components of an optical assembly Physics 2 Active
US7470622B2 Fabrication and use of polished silicon micro-mirrors Physics 1 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.