Patent · US Expired

Micromechanical component and manufacturing method

US6832523B2 · kind B2 · utility

5Cited by

3References

29Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Hubert Benzel · Neckartenzlingen, DE
Heribert Weber · Leverkusen, DE
Frank Schaefer · Lörrach, DE

Key dates

Filing date	Oct 29, 2001
Grant date	Dec 21, 2004
Priority date	—
Expiry date	Nov 27, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical component having a substrate and a diaphragm positioned on the substrate. Underneath the diaphragm a region made of porous material is provided, which mechanically supports the diaphragm and thermally insulates it.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.