Substrate treating apparatus
US6832616B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Jul 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention is directed to a substrate treating apparatus of a multi-nozzle type comprising an outer tube nozzle through which a chemical fluid, a combination of a chemical fluid and a gas, pure water, or a combination of pure water and a gas is discharged onto a substrate to be treated, and an inner tube nozzle through which a chemical fluid, a combination of a chemical fluid and a gas, pure water, or a combination of pure water and a gas is discharged onto the substrate. The inner tube nozzle may be provided in the outer tube nozzle such that the inner and outer tube nozzles constitute a multi-nozzle structure. The outer tube nozzle may have at a distal end a wafer top that may extend parallel to the substrate from the distal end, and be adapted to avoid contact with the substrate during treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.