Copper clad laminate
US6833198B2 · kind B2 · utility
14Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Jan 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the production of printed circuit boards. Specifically, the copper clad laminate is such that it includes electrodeposited copper foil for use in the laser beam drilling and is characterized in that the matte side of the above electrodeposited copper foil is used as the surface which the laser beam enters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.