Plate member separating apparatus and method
US6833312B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Jul 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention is to support a plate member such as a bonded substrate stack in a horizontal state without coming into contact with one surface of the member and also to efficiently progress separation. Separation is executed while arranging a bonded substrate stack (50) generated by bonding a seed substrate (10) to a handle substrate (20) such that the seed substrate (10) remains on the lower side. At the first stage, the peripheral portion is separated while causing a first substrate support section (101) to chuck and support the central portion of the lower surface of the bonded substrate stack (50). Then, at the second stage, the central portion is separated while causing a second substrate support section (102) to support the lower peripheral portion and side of the bonded substrate stack (50).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.