System and method for integrating optical layers in a PCB for inter-board communications
US6834131B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Dec 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09918
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Polymers of differing refraction indices are embedded within a PCB to provide optical connectivity of the PCB with other circuit boards via an optic backplane. The creation of islands of polymer material of refractive index n1 completely surrounded by polymer material with refractive index n2 where n1 has a higher index than n2 allows the islands of n1 indexed polymer to serve as optical waveguides. A process of forming a multi-layered PCB with the optical waveguide islands using successive laminations and using laser ablation to write the optical connection scheme is taught. Further, the use of uniquely marked targets in a copper layer to align the optical waveguides in production is also taught. Additionally, the use of clearing polymer materials and reinforcing polymer voids with prepreg lamination to allow a simple, high tolerance insertion of through-holes is taught.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.