Method and apparatus for batch processing of wafers in a furnace
US6835039B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Mar 13, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for batch processing of semiconductor wafers in a furnace advantageously allow for wafers to be supported for processing at very high temperatures (e.g., about 1350° C.). Each wafer is supported during processing by a wafer support with full perimeter support, such as a ring or plate. The wafers, on their supports, are removable and vertically spaced apart in a wafer support holder. A transfer station is provided wherein, during loading, a wafer is placed on a wafer support and, during unloading, the wafer is separated from the wafer support. A FOUP (Front Opening Unified Pod) is adapted to accommodate a plurality of wafer supports and to accommodate the transfer station. The wafer support, with a wafer supported on it, is transferred from the transfer station to a wafer support holder for processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.