Surface treatment for copper foil
US6835241B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | May 6, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a surface treatment agent that endows a copper foil with excellent adhesion to insulating resins.The surface treatment agent of the present invention has as its active components an organosilicic compound expressed by a following General Formula (1) and/or an organosilicic compound expressed by a General Formula (2) and an olefin-based silane coupling agent. The surface treatment agent of the present invention provides particularly excellent adhesion between an insulating resin and a low-profile copper foil used for a high-frequency-adaptable substrate. In Formulas (1) and (2), R1 is a hydroxyl group or a C1 to C5 alkyl group, and R2 is a C1 to C10 alkylene group that may contain oxygen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.