Method of patterning a substrate
US6835319B2 · kind B2 · utility
3Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2002 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Jun 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31111
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of patterning a substrate includes forming a liquid film on the substrate surface and directing laser energy from a laser through the film to etch the substrate surface. Etched material is carried away from the substrate surface via evaporation of the film during the etching. The liquid film may be formed on the substrate surface by jetting a liquid vapor onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.