Compliant layer chucking surface
US6835415B2 · kind B2 · utility
12Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Jan 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a “pin” chuck, thereby reducing the probability of entrapping a particle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.