Method for making a block for testing components

US6835577B2 · kind B2 · utility

Assignee

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Francois Baleras · Seyssinet-Pariset, FR
• Catherine Brunet-Manquat · Gières, FR

Key dates

• Filing date: Apr 21, 2003
• Grant date: Dec 28, 2004
• Expiry date: Jul 9, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R1/0483
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The invention relates to a test socket (10) for an electronic component, comprising a embossed support layer (12) comprising several embossments (16) with projecting relief, the embossments being provided with at least one conducting test area (14) near the top of the embossment, that may be brought into electrical contact with a terminal of the component.Application to testing bare or packaged electronic components.