Patent · US Expired

Method of checking electrical connections between a memory module and a semiconductor memory chip

US6836440B2 · kind B2 · utility

3Cited by

2References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Adler · Pau, FR
Thomas Huber · Schliersee, DE
Manfred Moser · Dachau, DE

Key dates

Filing date	Jan 30, 2003
Grant date	Dec 28, 2004
Priority date	—
Expiry date	May 31, 2023

Classification

Technology area (CPC G)Physics
CPC primaryG11C2207/105
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Two methods check functional capability of electrical connections between address lines of a printed circuit board of a memory module and address line contacts of an integrated semiconductor memory chip mounted on the printed circuit board. Ruptured solder contacts are conventionally examined optically or investigated by electrical resistance measurements; however, the latter do not work in the case of memory modules with a number of semiconductor chips, the pin contacts of which are connected in parallel by the address lines. The methods make it possible to locate interrupted contacts on individual address lines by the indirect use of a write-read access to the semiconductor memory chip, specifically utilizing the misrouting of writing and reading commands produced by defective contact connections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.